Gas Filled Panels: An Update on Applications in the Building Thermal Envelope

Publication Type

Conference Paper

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This paper discusses the application of Gas-Filled Panels to the building thermal envelope. Gas-Filled Panels, or GFPs, are thermal insulating devices that retain a high concentration of a low-conductivity gas, at atmospheric pressure, within a multilayer infrared reflective baffle. The thermal performance of the panel depends on the type of gas fill and the baffle configuration. We present computer simulation results showing the improvement in thermal resistance resulting from using an argon-GFP in place of glass fiber batt insulation in wood-frame construction. This report also presents estimates of the quantity and cost of material components needed to manufacture GFPs using current prototype designs.

Conference Name

BETEC Fall Symposium, Superinsulations and the Building Envelope

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Conference Location

Washington, DC

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